This item is being sold on behalf of one of our clients and is not held in our own stock.

Please enquire with us if you would like to buy this item as shipping, warranty and the terms and conditions of sale will be dependent on the client's needs.

DCA Instruments UHV Cluster Tool / MBE Growth, Linear Sputtering, Pre-Clean, Load Lock & Wafer Transfer System

This system is offered for sale on behalf of a client as surplus to requirements.

The system was originally supplied by DCA Instruments to the University of Southampton in 2014 and has been used and maintained on site until Autumn 2022. It was reportedly in working order when switched off, and was restarted in July 2024 to assess its condition, with all items found to be working at that time.

The system is a complete UHV cluster tool configured for automated wafer transfer between multiple deposition, cleaning, storage and loading chambers. It is designed to handle wafer sizes up to 6” / 150 mm diameter and comprises two MBE growth chambers, one linear sputtering chamber, one pre-cleaning chamber, one central distribution chamber, one storage chamber and one cassette load lock.

The system can be offered as a complete package or split into individual sections, subject to agreement.

Guide Pricing

Whole system: £150,000

Deposition chambers M800: £50,000 each

Sputterer: £50,000

Cleaning chamber: £20,000

Load lock, CDC and storage: £10,000

The system is offered in as-seen condition. Disassembly, packing, insurance and transport will require suitable planning and specialist handling. The University of Southampton has indicated that it can offer support to enable the activities required for removal of the tool, together with logistical support.

System Overview

The complete system consists of:

2 x MBE growth chambers

1 x UHV linear sputtering chamber

1 x pre-cleaning chamber

1 x central distribution chamber / CDC

1 x UHV storage chamber

1 x cassette load lock

UHV cluster tool wafer transfer system

Electronics racks, control panels and associated control equipment

Bakeout systems

Additional spares package

The chambers are connected via a UHV cluster tool arrangement providing automatic wafer transfer between the process chambers.

The MBE growth chambers are identical vertical 800 mm ID chambers, each configured with ports for effusion cells, e-guns, an RF plasma atom source and RHEED. The sputtering chamber is a UHV linear sputtering system fitted with four rectangular magnetrons for sequential deposition. The pre-cleaning chamber provides high-temperature substrate annealing and argon ion etching via a Kaufman-type broad beam ion source. The UHV storage chamber allows storage of up to 10 substrates or masks under UHV conditions.

Included Main System Sections

1. MBE Growth Chambers

Two identical M800 UHV MBE growth chambers are included.

Each growth chamber is a vertical 800 mm ID chamber designed for 6” wafers, with deposition uniformity stated as better than ±1.5% over the wafer area.

Each chamber includes:

4 x ports for effusion cells or other sources

4 x base ports for e-guns

Large-area LN2 cryopanel surrounding the substrate area

Water cooling panel above the e-gun positions

Vacuum Barrier Corporation / VBC type LN2 feedthroughs

Horizontally mounted linear shutters for effusion cells and e-guns

Substrate loading port

RHEED screen and RHEED gun ports

Quartz monitor ports

Pyrometer port

RGA port

Video camera port

Viewports and spare ports

Each growth chamber includes the following accessories:

1 x NW150CF viewport with viewport shutter

1 x Convectron gauge head connected to rough pumping line

4 x NW63CF viewports, three with shutters

Growth Chamber Pumping & Gauging

Each growth chamber is equipped with a high-capacity turbo pumping system including:

1 x Pfeiffer HiPace 1200 turbopump, 1250 l/s

1 x VAT NW200CF electro-pneumatic gate valve for turbo pump

1 x CTI-8 CryoTorr cryopump and compressor with helium lines

1 x temperature display for cryo cold head

1 x VAT NW200CF electro-pneumatic gate valve for cryo pump

2 x nude ion gauge heads

1 x Granville-Phillips 350 ion gauge controller with four set-points

Growth Chamber Substrate Manipulators

Each chamber includes a 6” substrate manipulator with high-temperature SiC heater element, heavy-duty Z-manipulator, magnetically coupled rotary drive, motorised rotation and Z-lift.

Specifications include:

Maximum substrate temperature: up to 920°C

Note: one growth chamber is equipped with a prototype heater element with lower resistance and is limited to approximately 700°C

Temperature uniformity: better than ±5°C at 600°C

Maximum oxygen pressure: 2 x 10⁻⁵ Torr at 800°C

Substrate rotation speed: up to 60 RPM

25 mm Z-drive travel with stepper motor control

Eurotherm PID temperature controller

3 kW DC power supply

Bakeable power and thermocouple cables

Safety interlock switches

Growth Chamber Sources & Deposition Hardware

Each growth chamber is equipped with:

3 x Telemark 100 cc UHV single pocket e-guns

4 x 155 cc dual filament effusion cells

4 x Eurotherm 3508 dual temperature controllers

4 x TDK-Lambda DC dual power supplies

1 x MAT60 RF plasma source for atomic oxygen/nitrogen

1 x 155 cc effusion cell mounting / reloading module

Source shutters for effusion cells and e-guns

Quartz rate monitoring system

Main substrate shutter

Effusion cells have a stated maximum continuous operating temperature of 1,400°C and include integral water-cooling shrouds.

2. UHV Linear Sputtering System

The sputtering chamber is a rectangular UHV chamber with four bottom-mounted magnetron positions. The substrate is moved linearly over the magnetrons for sequential deposition and scanning during deposition.

Sputtering Chamber Pumping & Gauging

Included with the sputtering chamber:

1 x Pfeiffer HiPace 1200 turbopump, 1250 l/s

1 x VAT NW200CF gate valve

1 x DCA UHV conductance control valve

1 x DCA valve controller

1 x nude ion gauge head

1 x Granville-Phillips 350 ion gauge controller

1 x MKS 100 mTorr full-scale Baratron with shut-off valve

Sputtering Chamber Substrate Manipulator

The sputtering chamber includes a substrate holder with motorised linear movement for accepting a 6” wafer and transporting it across the four deposition positions.

The heater stage allows heating up to 400°C and includes:

1 x SiC or foil filament heater element

1 x 1.5 kW DC power supply

1 x Eurotherm controller

1 x K-type thermocouple

Magnetrons & Power Supplies

The sputtering chamber includes:

4 x rectangular UHV magnetrons for 10” x 2” target size

1 x spare Advanced Energy rectangular UHV magnetron for 10” x 2” target size

4 x electro-pneumatic rotary shutters

1 x 3 kW DC power supply

1 x 1 kW RF power supply

4 x auto-tuning units

1 x RF/DC switch

Gas Manifold

The sputtering chamber gas manifold includes:

1 x 100 sccm MFC for argon

1 x 100 sccm MFC for oxygen

1 x 100 sccm MFC for third gas

3 x electro-pneumatic shut-off valves

1 x 4-channel MKS 146 controller

Sputtering Quartz Rate Monitor

The sputtering chamber includes:

4 x UHV quartz monitor heads

4 x electro-pneumatic shutters for the crystal

1 x quartz rate controller

3. Central Distribution Chamber / CDC

The CDC is a true UHV cluster tool wafer handler with magnetically coupled dual-axis wafer handling robot. It provides automated transfer between the process chambers.

Included:

1 x CDC chamber module with connection for up to six process chambers

1 x UHV wafer transfer robot with 6” end effector

5 x NW100CF viewports

5 x NW200CF electro-pneumatic gate valves

1 x 400 l/s ion pump

1 x titanium sublimation pump / TSP on NW200CF flange with water cooling panel

1 x nude ion gauge head

1 x Granville-Phillips 350 ion gauge controller

4. Cassette Load Lock

The cassette load lock allows loading of a cassette with up to 10 molybdenum substrate holders. It is turbo pumped and includes an internal heater stage for outgassing of cassette and substrates before transfer into the CDC chamber.

Included:

1 x vertical load lock chamber

1 x Viton-sealed quick access front-loading door

1 x 10-position platen loading cassette

1 x vent valve

1 x motorised vertical cassette Z-lift

1 x laser-based wafer position indicator

Molybdenum 6” wafer holders, exact quantity uncertain

1 x Pfeiffer HiPace 700 l/s turbopump

1 x NW150CF VAT electro-pneumatic gate valve

1 x nude ion gauge head

1 x Convectron gauge head

1 x Granville-Phillips 358 gauge controller

Internal Load Lock Heater

The internal load lock heater allows outgassing up to 200°C and includes:

1 x quartz lamp heater system

1 x temperature controller

1 x power supply

1 x timer

1 x vacuum interlock

5. Pre-Cleaning Chamber

The pre-cleaning chamber allows high-temperature outgassing of substrates and molybdenum holders before growth. It also includes a broad beam ion source for substrate surface cleaning and is separated from the CDC vacuum by a gate valve.

The chamber includes:

1 x UHV chamber with NW200CF connecting flange to CDC

1 x water-cooled chamber wall assembly

1 x high-temperature heater stage

1 x Eurotherm 3508 temperature controller

1 x DC power supply

1 x stainless steel support table

Ion Source

The ion source package includes:

1 x Kaufman-type broad beam ion source

1 x ion source power supply and controller

1 x 10 sccm mass flow controller for argon

1 x electro-pneumatic shut-off valve for argon supply

Pre-Clean Pumping & Gauging

Included:

1 x Pfeiffer HiPace 700 l/s turbopump

1 x Pfeiffer Adixen ACP 15 dry roots pump

1 x NW150CF VAT electro-pneumatic gate valve

1 x nude ion gauge head

1 x Granville-Phillips 350 ion gauge controller

6. Storage Chamber for Substrates & Masks

The storage chamber is used for substrate and/or mask storage under UHV. It is attached directly to the CDC chamber and shares the CDC vacuum.

Included:

1 x vertical storage chamber

1 x NW100CF viewport

1 x 10-position molybdenum holder / mask storage cassette

1 x motorised vertical cassette Z-lift

1 x laser-based platen position indicator

The chamber allows storage of up to 10 x 150 mm wafers. Contact masks can be loaded and removed in situ.

7. Bakeout Systems

The growth chambers, sputtering chamber, pre-clean chamber and CDC chamber have separate bakeout systems.

Included:

2 x flexible bakeout tents for growth chambers

1 x flexible bakeout tent for CDC chamber

1 x flexible bakeout tent for sputtering chamber

1 x flexible bakeout tent for pre-clean chamber

2 x movable bakeout heater units with forced air circulation

2 x K-type thermocouples

2 x temperature controllers

2 x timers

2 x vacuum interlocks

Separate heating jacket for the storage module

8. Electronics Racks & Control Equipment

The system includes the following control equipment:

5 x 19” rack mounting cabinets

5 x power distribution panels with circuit breakers

4 x emergency power off switches

3 x shutter and valve controller panels for manual operation

1 x interlock control panel with safety interlocks

1 x CDC controller with touchscreen control panel

Additional Spares Included

The following spares are included with the system:

1 x Pfeiffer HiPace 1200 turbomolecular pump, new

1 x SiC heating element for manipulators of growth or degas chambers, new

1 x Advanced Energy rectangular magnetron, 26532-LA Onyx UHV Standard Magnetron, new

Complete set of sputterer shields and clamps to allow continuous operation while one set is sent for cleaning

MAT60 spares package including:

2 x quartz discharge tubes

5 x quartz aperture plates

12 x alumina aperture plates with angled holes for optimised oxygen flux across 6” wafer

2 x spare tantalum shutters for e-guns

3 x spare tantalum shutters for K-cells

Condition

This system was used and maintained on site until Autumn 2022. It was reportedly still in working order when switched off and was restarted in July 2024 to assess its condition, with all items found to be working at that time.

The system is offered in as-seen condition. No further testing has been carried out by UniGreenScheme. Buyers are strongly advised to inspect the system and satisfy themselves as to its condition, configuration, completeness and suitability prior to purchase.

Due to the complexity, scale and specialist nature of the equipment, professional decommissioning, disassembly, packing, insurance and transportation will be required.

Removal, Logistics & Support

The system is located at the University of Southampton.

The University of Southampton has indicated that it can provide support to enable the activities required for removal of the tool, together with logistical support. Any removal, lifting, specialist contractor work, packing, insurance and transport costs are to be agreed separately.

Notes

This is a specialist UHV deposition and wafer-handling cluster tool and is suitable for experienced users with the appropriate facilities, infrastructure and technical capability to install, commission and operate the equipment.